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WEBINAR

Filling in the gaps: The evolution of high-density module design

THURSDAY, 25. JUNE 2020 10AM - 11AM (CEST, BERLIN)

  1. Zero-gap, shingled, paved: Different high-density approaches, and advantages and disadvantages of each.
  2. Technical challenges to closing the gap between cells in a module.
  3. Other techniques to boost module power density
  4. Why watt-peak per square meter is an important factor in module design
  5. The impact of larger wafer sizes
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